2024-03-29T12:13:10Zhttps://eprints.lib.hokudai.ac.jp/dspace-oai/requestoai:eprints.lib.hokudai.ac.jp:2115/421502019-03-18T10:02:37Zhdl_2115_40375hdl_2115_40231hdl_2115_139ニッケル・フィラーを用いるMgOどうしの拡散接合Diffusion Bonding of Two Blocks of MgO Using Ni-filler畠中, 裕次Hatanaka, Yuji新谷, 光二Atarashiya, Koji長崎, 隆吉Nagasaki, Ryukichi高橋, 忠義Takahashi, Tadayoshiopen access500北海道大学Hokkaido University1988-09-30jpndepartmental bulletin paperVoRhttp://hdl.handle.net/2115/421500385-602XAN00230223北海道大學工學部研究報告Bulletin of the Faculty of Engineering, Hokkaido University1434350https://eprints.lib.hokudai.ac.jp/dspace/bitstream/2115/42150/1/143_43-50.pdfapplication/pdf2.04 MB1988-09-30