2024-03-28T19:50:50Zhttps://eprints.lib.hokudai.ac.jp/dspace-oai/requestoai:eprints.lib.hokudai.ac.jp:2115/815402023-01-11T07:16:29Zhdl_2115_20053hdl_2115_145Sudden Discharging and Overcurrent Simulations of REBCO Coils Coated With Conductive Epoxy ResinMato, TakanobuNoguchi, SoCoilsEpoxy resinsThermal stabilityCircuit stabilityWindingsThermal conductivityStability criteriaConductive-epoxy-resin-coated REBCO coilmagnet stabilityno-insulation winding techniquequench protection540In 2011, a no-insulation (NI) winding technique was first proposed. Rare-Earth Barium Copper Oxide (REBCO) pancake coils using the NI winding technique are promising to generate an ultrahigh magnetic field, because the NI winding technique drastically enhances the thermal stability. When a local hot spot appears on a turn of the NI REBCO pancake coil, the enforced current can bypass into the adjacent turns to suppress the Joule heat generation. Recently, different types of REBCO coils to enhance the thermal stability by escaping the current flow from a local hot spot have been researched and developed. A few years ago, a REBCO single pancake coil whose upper surface was coated with conductive epoxy resin was proposed as one kind of NI winding techniques. The high thermal stability of conductive-epoxy-resin-coated (CERC) REBCO single pancake coil was demonstrated through an overcurrent test. However, the current behavior in the coil is still unclear. Therefore, we have newly developed an equivalent circuit model for CERC REBCO pancake coils. The sudden discharging and overcurrent tests were simulated for CERC REBCO pancake coils, and the resistance parameters were varied to investigate the coil stability.IEEE (Institute of Electrical and Electronics Engineers)Journal Articleapplication/pdfhttp://hdl.handle.net/2115/81540https://eprints.lib.hokudai.ac.jp/dspace/bitstream/2115/81540/1/conductive_epoxy_FINAL_VERSION.pdf1051-8223IEEE transactions on applied superconductivity31546007052021-08enginfo:doi/10.1109/TASC.2021.3057839© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.author