2024-03-29T15:24:42Zhttps://eprints.lib.hokudai.ac.jp/dspace-oai/requestoai:eprints.lib.hokudai.ac.jp:2115/9442022-11-17T02:08:08Zhdl_2115_20045hdl_2115_139Sn-Ag系はんだ組織に与える微量添加Alの効果とその接合性に関する研究Study of Effect of Al Addition into Sn-Ag Solder on Microstructure and Bondability鈴木, 直人田中, 順一成田, 敏夫Al additionsub-grainAg2Al particleshardnessdeformationthermal cyclecrack propagation566We researched the effect of Al addition into Sn-Ag solder alloys. Addition of small amount of Al into Sn-Ag alloys made sub-grains in the β-Sn phase finer. And many Ag2Al particles were dispersed. Both primary phase and eutectic phase in Sn-Ag-Al alloys were almost evenly deformed against tensile stress. Ag2Al particles obstructed the propagation of crack during thermal cycle, so propagation rate was delayed. Sn-2Ag-0.05Al and Sn-2Ag-0.1Al showed better mechanical property and thermal cycle property than Sn-3Ag-0.5Cu.社団法人 溶接学会Journal Articleapplication/pdfhttp://hdl.handle.net/2115/944https://eprints.lib.hokudai.ac.jp/dspace/bitstream/2115/944/1/11SMATE3-4%282%29.pdf11th Symposium on Microjoining and Assembly Technology in Electronics3461662005-02jpnauthor