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article (author version)Tanaka, Junichi; Takashima, Toshiyuki; Yoshimi, Kenji; Serizawa, Koji; Narita, ToshioDevelopment of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability-Electronics Goes Green 2004+ (EGG 2004) September 6-8, 2004, Berlin, Germany.-Sep-2004
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