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Direct Plating of Electroless Ni-P Layers on Sputter-Deposited Al-Ni Alloy Films

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Title: Direct Plating of Electroless Ni-P Layers on Sputter-Deposited Al-Ni Alloy Films
Authors: Azumi, Kazuhisa Browse this author
Yugiri, Takuma Browse this author
Kurihara, Toshiyuki Browse this author
Seo, Masahiro Browse this author
Habazaki, Hiroki Browse this author
Fujimoto, Shinji Browse this author
Issue Date: Jul-2003
Publisher: The Electrochemical Society
Journal Title: Journal of The Electrochemical Society
Volume: 150
Issue: 7
Start Page: C461
End Page: C464
Publisher DOI: 10.1149/1.1576770
Abstract: Direct plating of electroless Ni-P layers on Al-Ni alloy films formed on glass substrates was performed using magnetron-sputtered deposition and ion beam-assisted deposition methods. Dissolution of Al from the alloy films occurred in the initial stage of the plating process and resulted in enrichment of Ni on the surface. Since Ni acts as a catalyst for the Ni-P deposition reaction, Ni-P deposition occurs on the alloy surface without zincate pretreatment. In the case of an Al-10Ni alloy film, however, Ni clusters dropped from the Al-Ni alloy surface, and Ni-P particles grew in the plating bath, causing dissipation of chemicals in the bath. Such particles also readhered to the surface, resulting in a nonuniform plating layer. A lower concentration of Ni in an alloy such as an Al-3Ni or Al-1Ni alloy resulted in a rather smooth plating surface. In the case of a neutral plating bath containing a low concentration of P, cone structures were formed in the plating layer. Such structures seem to form at the nucleation sites of Ni deposition in the initial stage of the plating process. ©2003 The Electrochemical Society. All rights reserved.
Type: article
URI: http://hdl.handle.net/2115/22022
Appears in Collections:雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 安住 和久

 

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