Multiband Artificial Magnetic Conductors Using Stacked Microstrip Patch Layers

Inafune, Koji; Sano, Eiichi

Multiband Artificial Magnetic Conductors Using Stacked Microstrip Patch Layers

Inafune, Koji; Sano, Eiichi

2005

Permalink : https://hdl.handle.net/2115/13194

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論文情報

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アクセス権	open access
URI	https://hdl.handle.net/2115/13194
タイトル	Multiband Artificial Magnetic Conductors Using Stacked Microstrip Patch Layers
著者	著者名 Inafune, Koji
著者	e-Rad_Researcher 10333650 著者名 Sano, Eiichi 佐野, 栄一
言語	英語
キーワード	metamaterial
	artificial magnetic conductor
	FDTD
	electromagnetic simulation
発行日	2005-08
抄録	A two-dimensional microstrip patch array with a conducting via connecting the center of each patch to ground has been proposed for an artificial magnetic conductor (AMC). On the other hand, a microstrip patch array without vias has been shown to produce an AMC. This paper analyzes AMC structures with and without vias by using an effective medium model and finite difference time domain (FDTD) full-wave analysis method. The difference between the properties of these AMC structures is investigated in detail. Based on the results, we devised a multiband AMC structure having stacked microstrip patch layers. FDTD calculations and measurements were performed to demonstrate the effectiveness of the multiband AMC.
会議記述	会議名 IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications 回次 2005 開催地 Beijing 開催国 China
資源タイプ	会議発表論文
出版タイプ	Accepted Manuscript
関連情報 (isPartOf)	Title 2005 IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (Aug. 2005, Beijing, China)