Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations

Sasaki, Katsuhiko; Yanagimoto, Akiyuki; Ishikawa, Hiromasa

Engineering Plasticity from Macroscale to Nanoscale Pts 1 and 2, 2003, 779-784

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アクセス権
open access
URI
https://hdl.handle.net/2115/15888
タイトル
Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations
著者
Sasaki, Katsuhiko ; Yanagimoto, Akiyuki ; Ishikawa, Hiromasa
著者名
Sasaki, Katsuhiko
著者名
Yanagimoto, Akiyuki
著者名
Ishikawa, Hiromasa
言語
英語
キーワード
Lead Free Solder Alloy
Viscoplasticity
Constitutive Model
Creep
Stress Relaxation
Electronic Packaging
発行日
2003
出版者
Trans Tech Publications
収録物名
Engineering Plasticity from Macroscale to Nanoscale Pts 1 and 2
ページ
779-784
記述
Key Engineering Materials, Volume 233-236
抄録
In this paper, viscoplastic deformations of Sn-3.5Ag-0.75Cu solder alloy are discussed. First, the following experiments are conducted: (1) Pure tension at several strain rates. (2) Cyclic tension-compression loading with several strain amplitudes at several strain rates. (3) Creep tests at several stress levels. The test results show that the Sn-3.5Ag-0.75Cu solder alloy has large strain rate and temperature effects, and that there is a noticeable transient creep region in the creep curves. A viscoplastic constitutive model for the solder alloy is also discussed. The model is constructed based on the dislocation density based constitutive model proposed by Estrin [6]. The constitutive model well simulates both the time and temperature dependences on the deformation of the lead free solder alloy. Finally, the constitutive model is incorporated into a general purpose FEM program (Marc) to clarify the applicability of the model to the structural analysis.
資源タイプ
学術雑誌論文
出版タイプ
Accepted Manuscript
権利情報
the original is available online at www.scientific.net