Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films

Azumi, Kazuhisa; Egoshi, Shinnosuke; Kawashima, Satoshi et al.

Journal of The Electrochemical Society, 2007, 154(4), D220-D226

Permalink : https://hdl.handle.net/2115/22021

このアイテムのアクセス数:1,673件（2026-05-19 10:30 集計）

ファイル	フォーマット	サイズ	閲覧回数	説明
JECS154-4	pdf	1.82 MB	2,321

アクセス権	open access
URI	https://hdl.handle.net/2115/22021
タイトル	Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films
著者	Azumi, Kazuhisa ; Egoshi, Shinnosuke ; Kawashima, Satoshi ; Koyama, Yuuichi
e-Rad_Researcher 60175875 著者名 Azumi, Kazuhisa
著者名 Egoshi, Shinnosuke
著者名 Kawashima, Satoshi
著者名 Koyama, Yuuichi
言語	英語
発行日	2007
出版者	The Electrochemical Society
収録物名	Journal of The Electrochemical Society
巻(号)	154(4)
ページ	D220-D226
抄録	Etching pretreatment in H2SO4+CuSO4 solution was applied to magnetron sputter-deposited Al–Si alloy films formed on a glass plate to improve uniformity of Zn deposition in the double zincate process. In the etching process, a small amount of Cu was deposited on the alloy surface at a very high density to accompanying Al dissolution. These deposits acted as nucleation seeds for Zn deposition, resulting in uniform, fine and thin Zn layers on Al alloys in a zincate process. This effect was more prominent on Al alloys containing 2.0 or 2.6 atom % of Si than on those containing 0 or 1.0 atom % of Si. Such a discrepancy was caused by increased Cu deposition on Al–Si alloys with relatively high Si concentration. ©2007 The Electrochemical Society
資源タイプ	学術雑誌論文
出版タイプ	Version of Record
PISSN	0013-4651
関連情報 (isIdenticalTo)	出版社版DOI https://doi.org/10.1149/1.2436992