open access

https://hdl.handle.net/2115/36647

Fabrication of Cu micro-pattern on organic resin board by electroless plating and laser irradiation

日本語

printed circuit board

2008-08

表面技術協会

表面技術

59(8)

555-561

Printed circuit board with a Cu fine pattern was fabricated by electroless plating and laser irradiation. A glass fiber-reinforced epoxy resin plate was immersed in a Pd2+ containing solution, and then Cu metal layer was deposited on the epoxy resin by Cu electroless plating. After Cu plating, the Cu deposited specimen was irradiated with a pulsed Nd-YAG laser in air or doubly distilled water through an iris diaphragm and a convex lens to remove the Cu layer locally. The width of the Cu removed area in creased with increasing laser power and with decreasing scanning rate of the laser beam. In the case of laser irradiation in doubly distilled water, the Cu layer around the laser irradiated-area was rolled up to form less precise patterns. Fine Cu-pattern coils with 60μm width and 20μm intervals were fabricated on the epoxy resin by laser irradiation in air.

学術雑誌論文

Accepted Manuscript

0915-1869

AN1005202X