Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability

Tanaka, Junichi; Takashima, Toshiyuki; Yoshimi, Kenji; Serizawa, Koji; Narita, Toshio

Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability

Tanaka, Junichi; Takashima, Toshiyuki; Yoshimi, Kenji et al.

Electronics Goes Green 2004+ (EGG 2004) September 6-8, 2004, Berlin, Germany., 2004

Permalink : https://hdl.handle.net/2115/447

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アクセス権	open access
URI	https://hdl.handle.net/2115/447
タイトル	Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability
著者	Tanaka, Junichi ; Takashima, Toshiyuki ; Yoshimi, Kenji ; Serizawa, Koji ; Narita, Toshio
著者名 Tanaka, Junichi 田中, 順一
著者名 Takashima, Toshiyuki
著者名 Yoshimi, Kenji
著者名 Serizawa, Koji
著者名 Narita, Toshio
言語	英語
キーワード	Pb-free
キーワード	Sn-Ag-Al solder
発行日	2004-09
出版者	Electronics Goes Green
収録物名	Electronics Goes Green 2004+ (EGG 2004) September 6-8, 2004, Berlin, Germany.
記述	Proceedings of "Electronics Goes Green 2004+ : Driving Forces for Future Electronics"
記述	http://egg2004.izm.fraunhofer.de/
抄録	Addition of small amount of Al suppressed super cooling of Sn-Ag solders completely under normal cooling rates and the Sn-2Ag-0.1Al solder has a fine structure with an average grain sizes less than 10 micron-meter. Stress-strain measurements showed that the Sn-2Ag-0.1Al solder have fracture strain and toughness superior than the conventional Sn-Ag solders and wetting of the Sn-2Ag-0.1Al solder was moderate. Thermal cycling test was carried for the Cu / ceramic module with a 200 micro meter Sn-2Ag-0.1Al solder sheet between 233 and 398K. Dor comparison purpose conventional solders as Sn-3Ag-0.5Cu were also tested under the same thermal cycling condition. It was found that the Sn-2Ag-0.1Al solder was still sound after the 300 T.C. in contrast to results for Sn-3Ag-0.5Cu failed completely after the 150 T.C.. The crack formed in the module with a Sn-2Ag-0.1Al solder propagated within the solder, but it was passed through the solder / Cu substrate interface for the module with a Sn-3Ag-0.5Cu. Micro-structuring process of the solder with Al addition could be discussed.
資源タイプ	学術雑誌論文
出版タイプ	Accepted Manuscript
権利情報	Creative Commons Attribution-NonCommercial-ShareAlike 2.1 Japan