Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy

Tang, Jinwei; Azumi, Kazuhisa

Surface and Coatings Technology, 2011, 205(8-9), 3050-3057

Permalink : https://hdl.handle.net/2115/45133

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ファイル	フォーマット	サイズ	閲覧回数	説明
SCT205-8-9_3050-3057	pdf	1.50 MB	2,263

アクセス権	open access
URI	https://hdl.handle.net/2115/45133
タイトル	Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy
著者	著者名 Tang, Jinwei
著者	著者名 Azumi, Kazuhisa
言語	英語
キーワード	AZ91 D Mg alloy
	Zincate pretreatment
	Copper electrodeposition
	Adhesion strength
発行日	2011-01-25
出版者	Elsevier B.V.
収録物名	Surface and Coatings Technology
巻(号)	205(8-9)
ページ	3050-3057
抄録	Cu was electrodeposited on AZ91 D Mg alloy with zincate pretreatment in an alkaline plating bath, and the effect of zincate pretreatment on adhesion strength of the Cu layer was investigated. Scanning electron microscopy results showed that Zn was mainly deposited on the α-phase surface, and ultrasonic agitation at the initial stage of the zincate pretreatment improved the coverage of the Zn layer even on the β-phase surface, resulting in enhancement of the adhesion strength of the Zn layer and the successive Cu layer to the substrate. Adhesion tests revealed that the plating layer peeled off at the mixed layer of Zn and Cu deposits formed at the interface between the zincated layer and the electrodeposited Cu layer. A smooth Cu surface was obtained in the plating bath containing H3BO3.
資源タイプ	学術雑誌論文
出版タイプ	Accepted Manuscript
PISSN	0257-8972
関連情報 (isVersionOf)	出版社版DOI https://doi.org/10.1016/j.surfcoat.2010.11.021