open access

https://hdl.handle.net/2115/46930

Effect of Copper Pretreatment on the Zincate Process and Subsequent Copper Electrodeposition of AZ31 Magnesium Alloy

英語

X-ray chemical analysis

2011-06-29

The Electrochemical Society

Journal of the Electrochemical Society

158(9)

D535-D540

A small amount of Cu^[2+] ions was added to the activation bath used for pretreatment of the plating process of an AZ31 Mg alloy. In the activation process, a small amount of Cu was deposited at high density on the substrate surface accompanying Mg dissolution (Cu pretreatment). These Cu deposits acted as nucleation seeds for Zn deposition in the following zincate process and provided a uniform and dense Zn layer almost completely covering the substrate. The Cu layer electroplated on this zincated substrate showed considerable improvement in density and uniformity compared with those of the sample without Cu pretreatment. Cross-sectional SEM observation revealed that a less-defective interface between the Cu layer and substrate was obtained for the Cu-prepared sample. This structure also contributed to the improvement of adhesion strength. The mechanism of this improvement was investigated using electrochemical measurement and scanning electron microscopy observation with energy dispersive X-ray spectroscopy analysis.

学術雑誌論文

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© The Electrochemical Society, Inc. 2011. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in J. Electrochem. Soc., 158(9), pp. D535-D540 (2011)

0013-4651