Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

Yonezawa, Tetsu; Tsukamoto, Hiroki; Yong, Yingqiong et al.

RSC advances, 2016, 6(15), 12048-12052

Permalink : https://hdl.handle.net/2115/60845

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アクセス権	open access
URI	https://hdl.handle.net/2115/60845
タイトル	Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation
著者	Yonezawa, Tetsu ; Tsukamoto, Hiroki ; Yong, Yingqiong ; Mai Thanh Nguyen ; Matsubara, Masaki
e-Rad_Researcher 90284538 著者名 Yonezawa, Tetsu
著者名 Tsukamoto, Hiroki
著者名 Yong, Yingqiong
著者名 Mai Thanh Nguyen
著者名 Matsubara, Masaki
言語	英語
発行日	2016-01-29
出版者	Royal Society of Chemistry
収録物名	RSC advances
巻(号)	6(15)
ページ	12048-12052
抄録	A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degrees C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 x 10(-6) Omega m). This novel process may open a new strategy in the field of printed electronics.
資源タイプ	学術雑誌論文
出版タイプ	Version of Record
権利情報	Creative Commons Attribution 3.0 Unported
PISSN	2046-2069
関連情報 (isIdenticalTo)	出版社版DOI https://doi.org/10.1039/c5ra25058g