Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

Yong, Yingqiong; Mai Thanh Nguyen; Yonezawa, Tetsu et al.

Journal of materials chemistry C, 2017, 5(5), 1033-1041

Permalink : https://hdl.handle.net/2115/65126

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アクセス権
open access
URI
https://hdl.handle.net/2115/65126
タイトル
Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
著者
Yong, Yingqiong ; Mai Thanh Nguyen ; Yonezawa, Tetsu ; Asano, Takashi ; Matsubara, Masaki ; Tsukamoto, Hiroki ; Liao, Ying-Chih ; Zhang, Tengfei ; Isobe, Shigehito ; Nakagawa, Yuki
著者名
Yong, Yingqiong
著者名
Mai Thanh Nguyen
e-Rad_Researcher
90284538
著者名
Yonezawa, Tetsu
著者名
Asano, Takashi
著者名
Matsubara, Masaki
著者名
Tsukamoto, Hiroki
著者名
Liao, Ying-Chih
著者名
Zhang, Tengfei
e-Rad_Researcher
10564370
著者名
Isobe, Shigehito
著者名
Nakagawa, Yuki
言語
英語
発行日
2017
出版者
Royal Society of Chemistry
収録物名
Journal of materials chemistry C
巻(号)
5(5)
ページ
1033-1041
抄録
A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2- propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 degrees C. Following sintering at a temperature of 100 degrees C, the lowest reported resistivity (8.8 x 10(-7) Omega m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex.
資源タイプ
学術雑誌論文
出版タイプ
Version of Record
権利情報
Creative Commons Attribution 3.0 Unported
PISSN
2050-7526
関連情報 (isIdenticalTo)
出版社版DOI
https://doi.org/10.1039/c6tc04360g