open access

https://hdl.handle.net/2115/93882

Controlling Dielectric Film Defects to Increase the Breakdown Voltage of Conductive Polymer Solid Capacitors

英語

breakdown potential

2024-01-10

American Chemical Society

ACS applied materials & interfaces

16(1)

1737-1748

Aluminum solid polymer capacitors are promising devices for the increased demand for power electronics applications. Nonetheless, the low breakdown voltage of commercially available catalysts (similar to 100 V) limits their applications. In this study, a hydroxide-film-covered high-purity aluminum was anodized at 700 V in boric acid at 85 degrees C, and the effect of a second hot water immersion (posthydration treatment) after anodizing on the breakdown voltage was studied as a possible future treatment to enhance the withstand voltages of solid electrolytic capacitors. The dielectric breakdown voltage of the anodized aluminum with a PEDOT:PSS coating was similar to 500 V, being similar to 200 V less than the anodizing voltage; however, the dielectric breakdown voltage was increased above 700 V by introducing the posthydration treatment due to the formation of a nanovoid layer above the dielectric alumina film. Our research suggests that the highly dispersed nanovoids incorporated with PEDOT:PSS avoid the current concentration at some local regions, effectively increasing the dielectric breakdown voltage. The posthydration treatment increased the leakage current by introducing physical defects in the dielectric film. However, the leakage current was reduced by a voltage sweep below the breakdown voltage after the PEDOT:PSS coating or a second anodizing process before the coating, keeping the breakdown voltage above 600 V. A promising processing route to obtain aluminum solid capacitors with high withstand voltage (600 V) found in our research is, first, dipping in hot water; second, anodizing at 700 V; then a second hot water treatment; and a second anodizing at 400 V, which keeps the capacitance invariable with a breakdown voltage enhanced.

学術雑誌論文

Accepted Manuscript

This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS applied materials & interfaces, copyright © 2024 American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see http://pubs.acs.org/articlesonrequest/AOR-XIKN5UUARUW6NGTC6KR2.

1944-8244