無電解銅メッキ被覆によるFeTi_[1.1]水素貯蔵合金の微粉化防止法


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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/41994

Title:	無電解銅メッキ被覆によるFeTi_[1.1]水素貯蔵合金の微粉化防止法
Other Titles:	Electroless Copper Plating for Preventing Pulverization of FeTi_[1.1] Hydrogen Storage Alloy
Authors:	水野, 忠彦¹ Browse this author
	北吹, 順一² Browse this author
	諸住, 高³ Browse this author
Authors(alt):	Mizuno, Tadahiko¹
	Kitabuki, Junichi²
	Morozumi, Takashi³
Issue Date:	31-Jul-1986
Publisher:	北海道大学
Journal Title:	北海道大學工學部研究報告
Journal Title(alt):	Bulletin of the Faculty of Engineering, Hokkaido University
Volume:	132
Start Page:	147
End Page:	154
Type:	bulletin (article)
URI:	http://hdl.handle.net/2115/41994
Appears in Collections:	北海道大学工学部研究報告 = Bulletin of the Faculty of Engineering, Hokkaido University > No.132

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