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北海道大学工学部研究報告 = Bulletin of the Faculty of Engineering, Hokkaido University >
No.132 >

無電解銅メッキ被覆によるFeTi_[1.1]水素貯蔵合金の微粉化防止法

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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/41994

Title: 無電解銅メッキ被覆によるFeTi_[1.1]水素貯蔵合金の微粉化防止法
Other Titles: Electroless Copper Plating for Preventing Pulverization of FeTi_[1.1] Hydrogen Storage Alloy
Authors: 水野, 忠彦1 Browse this author
北吹, 順一2 Browse this author
諸住, 高3 Browse this author
Authors(alt): Mizuno, Tadahiko1
Kitabuki, Junichi2
Morozumi, Takashi3
Issue Date: 31-Jul-1986
Publisher: 北海道大学
Journal Title: 北海道大學工學部研究報告
Journal Title(alt): Bulletin of the Faculty of Engineering, Hokkaido University
Volume: 132
Start Page: 147
End Page: 154
Type: bulletin (article)
URI: http://hdl.handle.net/2115/41994
Appears in Collections:北海道大学工学部研究報告 = Bulletin of the Faculty of Engineering, Hokkaido University > No.132

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