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Silver-modulated SiO2-supported copper catalysts for selective hydrogenation of dimethyl oxalate to ethylene glycol

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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/54629

Title: Silver-modulated SiO2-supported copper catalysts for selective hydrogenation of dimethyl oxalate to ethylene glycol
Authors: Huang, Ying Browse this author
Ariga, Hiroko Browse this author
Zheng, Xinlei Browse this author
Duan, Xinping Browse this author
Takakusagi, Satoru Browse this author →KAKEN DB
Asakura, Kiyotaka Browse this author →KAKEN DB
Yuan, Youzhu Browse this author
Keywords: Copper
Silver
Hydrogenation
Dimethyl oxalate
Ethylene glycol
Issue Date: Nov-2013
Publisher: Academic Press Inc. Elsevier Science
Journal Title: Journal of catalysis
Volume: 307
Start Page: 74
End Page: 83
Publisher DOI: 10.1016/j.jcat.2013.07.006
Abstract: We present the application of a one-step urea-assisted gelation method to prepare a SiO2-supported bimetallic catalyst composed of copper (Cu) and silver (Ag). Results show the remarkably enhanced performance of the catalyst for selective hydrogenation of dimethyl oxalate (DMO) to ethylene glycol (EG). Coupled with a series of characterization and kinetic studies, the improved activity is attributed to the formation of Cu nanoparticles containing Ag nanoclusters on the SiO2 surface. The coherent interactions between the Cu and Ag species help create the active Cu+/Cu-0 species in a suitable proportion and prevent the transmigration of bimetallic nanoparticles during the hydrogenation process. The optimized Cu-Ag/SiO2 catalyst with an Ag/Cu atomic ratio of 0.05 has a balanced Cu+/Cu-0 ratio and highly dispersed bimetal particles, which account for its high turnover frequency, EG selectivity of 97.0%, and excellent catalytic stability during the hydrogenation of DMO to EG for longer than 150 h.
Type: article (author version)
URI: http://hdl.handle.net/2115/54629
Appears in Collections:触媒科学研究所 (Institute for Catalysis) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 朝倉 清高

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