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The effect of dentine surface preparation and reduced application time of adhesive on bonding strength

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Title: The effect of dentine surface preparation and reduced application time of adhesive on bonding strength
Authors: Saikaew, Pipop Browse this author
Chowdhury, A. F. M. Almas Browse this author
Fukuyama, Mai Browse this author
Kakuda, Shinichi Browse this author
Carvalho, Ricardo M. Browse this author
Sano, Hidehiko Browse this author →KAKEN DB
Keywords: Universal adhesives
Microtensile bond strength
Bonding application time
Surface preparation
Issue Date: Apr-2016
Publisher: Elsevier
Journal Title: Journal of dentistry
Volume: 47
Start Page: 63
End Page: 70
Publisher DOI: 10.1016/j.jdent.2016.02.001
PMID: 26855030
Abstract: Objective: This study evaluated the effects of surface preparation and the application time of adhesives on the resin-dentine bond strengths with universal adhesives. Methods: Sixty molars were cut to exposed mid-coronal dentine and divided into 12 groups (n = 5) based on three factors; (1) adhesive: G-Premio Bond (GP, GC Corp., Tokyo, Japan), Clearfil Universal Bond (CU, Kuraray Noritake Dental Inc., Okayama, Japan) and Scotchbond Universal Adhesive (SB, 3M ESPE, St. Paul, MN, USA); (2) smear layer preparation: SiC paper ground dentine or bur-cut dentine; (3) application time: shortened time or as manufacturer's instruction. Fifteen resin-dentine sticks per group were processed for microtensile bond strength test (mu TBS) according to non-trimming technique (1 mm(2)) after storage in distilled water (37 degrees C) for 24 h. Data were analyzed by three-way ANOVA and Dunnett T3 tests (alpha = 0.05). Fractured surfaces were observed under scanning electron microscope (SEM). Another 12 teeth were prepared and cut into slices for SEM examination of bonded interfaces. Results: mu TBS were higher when bonded to SiC-ground dentine according to manufacturer's instruction. Bonding to bur-cut dentine resulted in significantly lower mu TBS (p < 0.000). Shortening the application time resulted in significantly lower bond strength for CU on SiC and GP on bur-cut dentine. SEM of fractured surfaces revealed areas with a large amount of porosities at the adhesive resin interface. This was more pronounced when adhesives were bonded with a reduced application time and on bur cut dentine. (C) 2016 Elsevier Ltd. All rights reserved.
Rights: © 2016, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
Type: article (author version)
Appears in Collections:歯学院・歯学研究院 (Graduate School of Dental Medicine / Faculty of Dental Medicine) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: Pipop Saikaew

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