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The effect of dentine surface preparation and reduced application time of adhesive on bonding strength

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タイトル: The effect of dentine surface preparation and reduced application time of adhesive on bonding strength
著者: Saikaew, Pipop 著作を一覧する
Chowdhury, A. F. M. Almas 著作を一覧する
Fukuyama, Mai 著作を一覧する
Kakuda, Shinichi 著作を一覧する
Carvalho, Ricardo M. 著作を一覧する
Sano, Hidehiko 著作を一覧する
キーワード: Universal adhesives
Microtensile bond strength
Bonding application time
Surface preparation
SEM
発行日: 2016年 4月
出版者: Elsevier
誌名: Journal of dentistry
巻: 47
開始ページ: 63
終了ページ: 70
出版社 DOI: 10.1016/j.jdent.2016.02.001
抄録: Objective: This study evaluated the effects of surface preparation and the application time of adhesives on the resin-dentine bond strengths with universal adhesives. Methods: Sixty molars were cut to exposed mid-coronal dentine and divided into 12 groups (n = 5) based on three factors; (1) adhesive: G-Premio Bond (GP, GC Corp., Tokyo, Japan), Clearfil Universal Bond (CU, Kuraray Noritake Dental Inc., Okayama, Japan) and Scotchbond Universal Adhesive (SB, 3M ESPE, St. Paul, MN, USA); (2) smear layer preparation: SiC paper ground dentine or bur-cut dentine; (3) application time: shortened time or as manufacturer's instruction. Fifteen resin-dentine sticks per group were processed for microtensile bond strength test (mu TBS) according to non-trimming technique (1 mm(2)) after storage in distilled water (37 degrees C) for 24 h. Data were analyzed by three-way ANOVA and Dunnett T3 tests (alpha = 0.05). Fractured surfaces were observed under scanning electron microscope (SEM). Another 12 teeth were prepared and cut into slices for SEM examination of bonded interfaces. Results: mu TBS were higher when bonded to SiC-ground dentine according to manufacturer's instruction. Bonding to bur-cut dentine resulted in significantly lower mu TBS (p < 0.000). Shortening the application time resulted in significantly lower bond strength for CU on SiC and GP on bur-cut dentine. SEM of fractured surfaces revealed areas with a large amount of porosities at the adhesive resin interface. This was more pronounced when adhesives were bonded with a reduced application time and on bur cut dentine. (C) 2016 Elsevier Ltd. All rights reserved.
Rights: © 2016, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/
資料タイプ: article (author version)
URI: http://hdl.handle.net/2115/65016
出現コレクション:雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

提供者: Pipop Saikaew

 

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