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The effect of dentine surface preparation and reduced application time of adhesive on bonding strength
This item is licensed under:Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
| Title: | The effect of dentine surface preparation and reduced application time of adhesive on bonding strength |
| Authors: | Saikaew, Pipop Browse this author | | Chowdhury, A. F. M. Almas Browse this author | | Fukuyama, Mai Browse this author | | Kakuda, Shinichi Browse this author | | Carvalho, Ricardo M. Browse this author | | Sano, Hidehiko Browse this author →KAKEN DB |
| Keywords: | Universal adhesives | | Microtensile bond strength | | Bonding application time | | Surface preparation | | SEM |
| Issue Date: | Apr-2016 |
| Publisher: | Elsevier |
| Journal Title: | Journal of dentistry |
| Volume: | 47 |
| Start Page: | 63 |
| End Page: | 70 |
| Publisher DOI: | 10.1016/j.jdent.2016.02.001 |
| PMID: | 26855030 |
| Abstract: | Objective: This study evaluated the effects of surface preparation and the application time of adhesives on the resin-dentine bond strengths with universal adhesives. Methods: Sixty molars were cut to exposed mid-coronal dentine and divided into 12 groups (n = 5) based on three factors; (1) adhesive: G-Premio Bond (GP, GC Corp., Tokyo, Japan), Clearfil Universal Bond (CU, Kuraray Noritake Dental Inc., Okayama, Japan) and Scotchbond Universal Adhesive (SB, 3M ESPE, St. Paul, MN, USA); (2) smear layer preparation: SiC paper ground dentine or bur-cut dentine; (3) application time: shortened time or as manufacturer's instruction. Fifteen resin-dentine sticks per group were processed for microtensile bond strength test (mu TBS) according to non-trimming technique (1 mm(2)) after storage in distilled water (37 degrees C) for 24 h. Data were analyzed by three-way ANOVA and Dunnett T3 tests (alpha = 0.05). Fractured surfaces were observed under scanning electron microscope (SEM). Another 12 teeth were prepared and cut into slices for SEM examination of bonded interfaces. Results: mu TBS were higher when bonded to SiC-ground dentine according to manufacturer's instruction. Bonding to bur-cut dentine resulted in significantly lower mu TBS (p < 0.000). Shortening the application time resulted in significantly lower bond strength for CU on SiC and GP on bur-cut dentine. SEM of fractured surfaces revealed areas with a large amount of porosities at the adhesive resin interface. This was more pronounced when adhesives were bonded with a reduced application time and on bur cut dentine. (C) 2016 Elsevier Ltd. All rights reserved. |
| Rights: | © 2016, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/ | | http://creativecommons.org/licenses/by-nc-nd/4.0/ |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/65016 |
| Appears in Collections: | 歯学院・歯学研究院 (Graduate School of Dental Medicine / Faculty of Dental Medicine) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: Pipop Saikaew
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