Studies on Anisotropic Electrodeposition of Copper with Organic Additives


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Please use this identifier to cite or link to this item:https://doi.org/10.14943/doctoral.r7080

Related Items in HUSCAP:

Title:	Studies on Anisotropic Electrodeposition of Copper with Organic Additives
Other Titles:	有機添加剤を用いた銅の異方的電気化学析出に関する研究
Authors:	端場, 登志雄 Browse this author
Issue Date:	25-Mar-2019
Publisher:	Hokkaido University
Conffering University:	北海道大学
Degree Report Number:	乙第7080号
Degree Level:	博士
Degree Discipline:	理学
Examination Committee Members:	(主査) 教授村越敬, 特任教授喜多村曻, 特任教授日夏幸雄, 教授安住和久, 理事長特別参与魚崎浩平(物質・材料研究機構)
Degree Affiliation:	総合化学院
Type:	theses (doctoral)
URI:	http://hdl.handle.net/2115/74091
Appears in Collections:	論文博士 (Doctorate by way of Dissertation) > 総合化学院(Graduate School of Chemical Sciences and Engineering) 学位論文 (Theses) > 博士　（理学）

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