HUSCAP logo Hokkaido Univ. logo

Hokkaido University Collection of Scholarly and Academic Papers >

Sort by: In order: Results/Page Authors/Record:
Export metadata:
Showing results 1 to 1 of 1
TypeAuthor(s)TitleOther TitlesCitationCitation(alt)Issue Date
article石橋, 正博; 藤本, 健資; 池田, 賢一; 波多, 聰; 中島, 英治コイルばねクリープ試験法による Sn 系はんだ合金の低応力域における高温変形挙動High Temperature Deformation Behavior of Sn-Based Solder Alloys under Low Stress Conditions by a Helical Spring Creep Testing Method日本金属学会誌Journal of the Japan Institute of MetalsMay-2009
Showing results 1 to 1 of 1

 

Feedback - Hokkaido University