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コイルばねクリープ試験法による Sn 系はんだ合金の低応力域における高温変形挙動

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J. Jpn Inst. Metal 73(5) 373.pdf2.2 MBPDFView/Open
Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/75539

Title: コイルばねクリープ試験法による Sn 系はんだ合金の低応力域における高温変形挙動
Other Titles: High Temperature Deformation Behavior of Sn-Based Solder Alloys under Low Stress Conditions by a Helical Spring Creep Testing Method
Authors: 石橋, 正博1 Browse this author
藤本, 健資2 Browse this author
池田, 賢一3 Browse this author →KAKEN DB
波多, 聰4 Browse this author
中島, 英治5 Browse this author
Authors(alt): Ishibashi, Masahiro1
Fujimoto, Kensuke2
Ikeda, Ken-ichi3
Hata, Satoshi4
Nakashima, Hideharu5
Keywords: helical spring
creep
high temperature deformation
low stress
stress exponent
solder
tin-silber-copper alloy
Issue Date: May-2009
Publisher: 日本金属学会
Journal Title: 日本金属学会誌
Journal Title(alt): Journal of the Japan Institute of Metals
Volume: 73
Issue: 5
Start Page: 373
End Page: 380
Publisher DOI: 10.2320/jinstmet.73.373
Abstract: In the field of electronics, it is crucial to guarantee long-term joint reliability of the Sn-Ag-Cu solder alloy. Creep tests in low-stresses are necessary to guarantee the reliability. However, a very long period of time is required for the creep tests. To decide a steady-state creep strain rate, an approximate equation of a creep curve was newly applied to the helical spring creep test known as a method of a low-stress creep test. Obtained results are as follows. (1) The torsional strain component is decreased with the deformation of the helical spring shaped specimen. Therefore, the steady-state creep rate cannot be detected in the helical spring creep test. The approximate equation of a creep curve introduced by Li's group was found to be effective to obtain the steady-state creep rate for Sn-based solder alloy. (2) The helical spring creep testing method that uses the torsional deformation of the test specimen is more effective for the Sn-based solder alloy with a strong anisotropy of strength than the uniaxis creep testing method. (3) In the heat-treated Sn-3.0 mass%Ag-0.5 mass%Cu solder alloy, the creep stress exponent changed from 19 into 1.1 on the boundary of about 14 MPa. This result implies that the creep deformation mechanism was changed from the dislocation creep with dispersion-strengthening to the grain boundary sliding. This phenomenon was found for the first time by using the helical spring creep testing method.
Type: article
URI: http://hdl.handle.net/2115/75539
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 池田 賢一

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