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Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations
| Title: | Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations |
| Authors: | Sasaki, Katsuhiko Browse this author | | Yanagimoto, Akiyuki Browse this author | | Ishikawa, Hiromasa Browse this author |
| Keywords: | Lead Free Solder Alloy | | Viscoplasticity | | Constitutive Model | | Creep | | Stress Relaxation | | Electronic Packaging |
| Issue Date: | 2003 |
| Publisher: | Trans Tech Publications |
| Journal Title: | Engineering Plasticity from Macroscale to Nanoscale Pts 1 and 2 |
| Start Page: | 779 |
| End Page: | 784 |
| Abstract: | In this paper, viscoplastic deformations of Sn-3.5Ag-0.75Cu solder alloy are discussed. First, the following experiments are conducted: (1) Pure tension at several strain rates. (2) Cyclic tension-compression loading with several strain amplitudes at several strain rates. (3) Creep tests at several stress levels. The test results show that the Sn-3.5Ag-0.75Cu solder alloy has large strain rate and temperature effects, and that there is a noticeable transient creep region in the creep curves. A viscoplastic constitutive model for the solder alloy is also discussed. The model is constructed based on the dislocation density based constitutive model proposed by Estrin [6]. The constitutive model well simulates both the time and temperature dependences on the deformation of the lead free solder alloy. Finally, the constitutive model is incorporated into a general purpose FEM program (Marc) to clarify the applicability of the model to the structural analysis. |
| Description: | Key Engineering Materials, Volume 233-236 |
| Rights: | the original is available online at www.scientific.net |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/15888 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 佐々木 克彦
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