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Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations

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タイトル: Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations
著者: Sasaki, Katsuhiko 著作を一覧する
Yanagimoto, Akiyuki 著作を一覧する
Ishikawa, Hiromasa 著作を一覧する
キーワード: Lead Free Solder Alloy
Viscoplasticity
Constitutive Model
Creep
Stress Relaxation
Electronic Packaging
発行日: 2003年
出版者: Trans Tech Publications
誌名: Engineering Plasticity from Macroscale to Nanoscale Pts 1 and 2
開始ページ: 779
終了ページ: 784
抄録: In this paper, viscoplastic deformations of Sn-3.5Ag-0.75Cu solder alloy are discussed. First, the following experiments are conducted: (1) Pure tension at several strain rates. (2) Cyclic tension-compression loading with several strain amplitudes at several strain rates. (3) Creep tests at several stress levels. The test results show that the Sn-3.5Ag-0.75Cu solder alloy has large strain rate and temperature effects, and that there is a noticeable transient creep region in the creep curves. A viscoplastic constitutive model for the solder alloy is also discussed. The model is constructed based on the dislocation density based constitutive model proposed by Estrin [6]. The constitutive model well simulates both the time and temperature dependences on the deformation of the lead free solder alloy. Finally, the constitutive model is incorporated into a general purpose FEM program (Marc) to clarify the applicability of the model to the structural analysis.
記述: Key Engineering Materials, Volume 233-236
Rights: the original is available online at www.scientific.net
資料タイプ: article (author version)
URI: http://hdl.handle.net/2115/15888
出現コレクション:雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

提供者: 佐々木 克彦

 

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