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Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films

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Title: Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films
Authors: Azumi, Kazuhisa Browse this author →KAKEN DB
Egoshi, Shinnosuke Browse this author
Kawashima, Satoshi Browse this author
Koyama, Yuuichi Browse this author
Issue Date: 2007
Publisher: The Electrochemical Society
Journal Title: Journal of The Electrochemical Society
Volume: 154
Issue: 4
Start Page: D220
End Page: D226
Publisher DOI: 10.1149/1.2436992
Abstract: Etching pretreatment in H2SO4+CuSO4 solution was applied to magnetron sputter-deposited Al–Si alloy films formed on a glass plate to improve uniformity of Zn deposition in the double zincate process. In the etching process, a small amount of Cu was deposited on the alloy surface at a very high density to accompanying Al dissolution. These deposits acted as nucleation seeds for Zn deposition, resulting in uniform, fine and thin Zn layers on Al alloys in a zincate process. This effect was more prominent on Al alloys containing 2.0 or 2.6 atom % of Si than on those containing 0 or 1.0 atom % of Si. Such a discrepancy was caused by increased Cu deposition on Al–Si alloys with relatively high Si concentration. ©2007 The Electrochemical Society
Type: article
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 安住 和久

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