Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films


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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/22021

Title:	Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films
Authors:	Azumi, Kazuhisa Browse this author →KAKEN DB
	Egoshi, Shinnosuke Browse this author
	Kawashima, Satoshi Browse this author
	Koyama, Yuuichi Browse this author
Issue Date:	2007
Publisher:	The Electrochemical Society
Journal Title:	Journal of The Electrochemical Society
Volume:	154
Issue:	4
Start Page:	D220
End Page:	D226
Publisher DOI:	10.1149/1.2436992
Abstract:	Etching pretreatment in H2SO4+CuSO4 solution was applied to magnetron sputter-deposited Al–Si alloy films formed on a glass plate to improve uniformity of Zn deposition in the double zincate process. In the etching process, a small amount of Cu was deposited on the alloy surface at a very high density to accompanying Al dissolution. These deposits acted as nucleation seeds for Zn deposition, resulting in uniform, fine and thin Zn layers on Al alloys in a zincate process. This effect was more prominent on Al alloys containing 2.0 or 2.6 atom % of Si than on those containing 0 or 1.0 atom % of Si. Such a discrepancy was caused by increased Cu deposition on Al–Si alloys with relatively high Si concentration. ©2007 The Electrochemical Society
Type:	article
URI:	http://hdl.handle.net/2115/22021
Appears in Collections:	工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 安住和久

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