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Title: 無電解めっきとレーザー照射による有機樹脂板上へのCuマイクロパターン形成
Other Titles: Fabrication of Cu micro-pattern on organic resin board by electroless plating and laser irradiation
Authors: 菊地, 竜也1 Browse this author →KAKEN DB
和智, 悠太2 Browse this author
坂入, 正敏3 Browse this author →KAKEN DB
高橋, 英明4 Browse this author
飯野, 潔5 Browse this author
片山, 直樹6 Browse this author
Authors(alt): Kikuchi, Tatsuya1
Wachi, Yuta2
Sakairi, Masatoshi3
Takahashi, Hideaki4
Iino, Kiyoshi5
Katayama, Naoki6
Keywords: electroless plating
laser irradiation
printed circuit board
Issue Date: Aug-2008
Publisher: 表面技術協会
Journal Title: 表面技術
Volume: 59
Issue: 8
Start Page: 555
End Page: 561
Abstract: Printed circuit board with a Cu fine pattern was fabricated by electroless plating and laser irradiation. A glass fiber-reinforced epoxy resin plate was immersed in a Pd2+ containing solution, and then Cu metal layer was deposited on the epoxy resin by Cu electroless plating. After Cu plating, the Cu deposited specimen was irradiated with a pulsed Nd-YAG laser in air or doubly distilled water through an iris diaphragm and a convex lens to remove the Cu layer locally. The width of the Cu removed area in creased with increasing laser power and with decreasing scanning rate of the laser beam. In the case of laser irradiation in doubly distilled water, the Cu layer around the laser irradiated-area was rolled up to form less precise patterns. Fine Cu-pattern coils with 60μm width and 20μm intervals were fabricated on the epoxy resin by laser irradiation in air.
Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 菊地 竜也

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