HUSCAP logo Hokkaido Univ. logo

Hokkaido University Collection of Scholarly and Academic Papers >
Graduate School of Engineering / Faculty of Engineering >
北海道大学工学部研究報告 = Bulletin of the Faculty of Engineering, Hokkaido University >
No.143 >

ニッケル・フィラーを用いるMgOどうしの拡散接合

Files in This Item:
143_43-50.pdf2.09 MBPDFView/Open
Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/42150

Title: ニッケル・フィラーを用いるMgOどうしの拡散接合
Other Titles: Diffusion Bonding of Two Blocks of MgO Using Ni-filler
Authors: 畠中, 裕次1 Browse this author
新谷, 光二2 Browse this author
長崎, 隆吉3 Browse this author
高橋, 忠義4 Browse this author
Authors(alt): Hatanaka, Yuji1
Atarashiya, Koji2
Nagasaki, Ryukichi3
Takahashi, Tadayoshi4
Issue Date: 30-Sep-1988
Publisher: 北海道大学
Journal Title: 北海道大學工學部研究報告
Journal Title(alt): Bulletin of the Faculty of Engineering, Hokkaido University
Volume: 143
Start Page: 43
End Page: 50
Type: bulletin (article)
URI: http://hdl.handle.net/2115/42150
Appears in Collections:北海道大学工学部研究報告 = Bulletin of the Faculty of Engineering, Hokkaido University > No.143

Export metadata:

OAI-PMH ( junii2 , jpcoar_1.0 )

MathJax is now OFF:


 

 - Hokkaido University