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北海道大学工学部研究報告 = Bulletin of the Faculty of Engineering, Hokkaido University >
No.143 >
ニッケル・フィラーを用いるMgOどうしの拡散接合
Title: | ニッケル・フィラーを用いるMgOどうしの拡散接合 |
Other Titles: | Diffusion Bonding of Two Blocks of MgO Using Ni-filler |
Authors: | 畠中, 裕次1 Browse this author | 新谷, 光二2 Browse this author | 長崎, 隆吉3 Browse this author | 高橋, 忠義4 Browse this author |
Authors(alt): | Hatanaka, Yuji1 | Atarashiya, Koji2 | Nagasaki, Ryukichi3 | Takahashi, Tadayoshi4 |
Issue Date: | 30-Sep-1988 |
Publisher: | 北海道大学 |
Journal Title: | 北海道大學工學部研究報告 |
Journal Title(alt): | Bulletin of the Faculty of Engineering, Hokkaido University |
Volume: | 143 |
Start Page: | 43 |
End Page: | 50 |
Type: | bulletin (article) |
URI: | http://hdl.handle.net/2115/42150 |
Appears in Collections: | 北海道大学工学部研究報告 = Bulletin of the Faculty of Engineering, Hokkaido University > No.143
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