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Title: Sn-Ag-Al系合金/Cu接合による界面溶解反応と熱疲労サイクル特性
Other Titles: Interfacial Dissolution Reaction and Thermal Fatigue Cycle Property for Sn-Ag-Al Solder Alloy/Cu
Authors: 田中, 順一1 Browse this author
鈴木, 直人2 Browse this author
高島, 敏行3 Browse this author
成田, 敏夫4 Browse this author
Authors(alt): Tanaka, Junichi1
Suzuki, Naoto2
Takashima, Toshiyuki3
Narita, Toshio4
Keywords: Tensil properties
Thermal fatigue properties
Issue Date: Feb-2004
Publisher: 溶接学会(マイクロ接合研究委員会)
Journal Title: 10th Symposium on Microjoining and Assembly Technology in Electronics
Volume: 5-6
Start Page: 149
End Page: 154
Abstract: We investigated interfacial dissolution reaction and thermal fatigue cycle properties for Sn-Ag-Al solder alloy/Cu. Sn-Ag-Al solder alloys showed better tensile and thermal fatigue property than Sn-3Ag-0.5Cu. The dissolution speed Cu into Sn-2Ag-0.1Al is higher than that into Sn-3Ag-0.5Cu. We guessed the difference of the morphology and the speed of crack propagation between Sn-2Ag-0.1Al and Sn-3Ag-0.5Cu was generated by changing microstructure of solder near reaction layer.
Description: 「Mate 2004 エレクトロニクスにおけるマイクロ接合・ 実装技術シンポジウム - ブロードバンドインターネット時代に向けた生産技術革新とサイエンス」論文集収録。
Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 田中 順一

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