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Hokkaido University Collection of Scholarly and Academic Papers >
Graduate School of Engineering / Faculty of Engineering >
Peer-reviewed Journal Articles, etc >
Sn-Ag-Al系合金/Cu接合による界面溶解反応と熱疲労サイクル特性
| Title: | Sn-Ag-Al系合金/Cu接合による界面溶解反応と熱疲労サイクル特性 |
| Other Titles: | Interfacial Dissolution Reaction and Thermal Fatigue Cycle Property for Sn-Ag-Al Solder Alloy/Cu |
| Authors: | 田中, 順一1 Browse this author | | 鈴木, 直人2 Browse this author | | 高島, 敏行3 Browse this author | | 成田, 敏夫4 Browse this author |
| Authors(alt): | Tanaka, Junichi1 | | Suzuki, Naoto2 | | Takashima, Toshiyuki3 | | Narita, Toshio4 |
| Keywords: | Tensil properties | | Thermal fatigue properties |
| Issue Date: | Feb-2004 |
| Publisher: | 溶接学会（マイクロ接合研究委員会） |
| Journal Title: | 10th Symposium on Microjoining and Assembly Technology in Electronics |
| Volume: | 5-6 |
| Start Page: | 149 |
| End Page: | 154 |
| Abstract: | We investigated interfacial dissolution reaction and thermal fatigue cycle properties for Sn-Ag-Al solder alloy/Cu. Sn-Ag-Al solder alloys showed better tensile and thermal fatigue property than Sn-3Ag-0.5Cu. The dissolution speed Cu into Sn-2Ag-0.1Al is higher than that into Sn-3Ag-0.5Cu. We guessed the difference of the morphology and the speed of crack propagation between Sn-2Ag-0.1Al and Sn-3Ag-0.5Cu was generated by changing microstructure of solder near reaction layer. |
| Description: | 「Mate 2004 エレクトロニクスにおけるマイクロ接合・
実装技術シンポジウム - ブロードバンドインターネット時代に向けた生産技術革新とサイエンス」論文集収録。 |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/422 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 田中 順一
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