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Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability

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Title: Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability
Authors: Tanaka, Junichi1 Browse this author
Takashima, Toshiyuki Browse this author
Yoshimi, Kenji Browse this author
Serizawa, Koji Browse this author
Narita, Toshio Browse this author
Authors(alt): 田中, 順一1
Keywords: Pb-free
Sn-Ag-Al solder
Issue Date: Sep-2004
Publisher: Electronics Goes Green
Journal Title: Electronics Goes Green 2004+ (EGG 2004) September 6-8, 2004, Berlin, Germany.
Abstract: Addition of small amount of Al suppressed super cooling of Sn-Ag solders completely under normal cooling rates and the Sn-2Ag-0.1Al solder has a fine structure with an average grain sizes less than 10 micron-meter. Stress-strain measurements showed that the Sn-2Ag-0.1Al solder have fracture strain and toughness superior than the conventional Sn-Ag solders and wetting of the Sn-2Ag-0.1Al solder was moderate. Thermal cycling test was carried for the Cu / ceramic module with a 200 micro meter Sn-2Ag-0.1Al solder sheet between 233 and 398K. Dor comparison purpose conventional solders as Sn-3Ag-0.5Cu were also tested under the same thermal cycling condition. It was found that the Sn-2Ag-0.1Al solder was still sound after the 300 T.C. in contrast to results for Sn-3Ag-0.5Cu failed completely after the 150 T.C.. The crack formed in the module with a Sn-2Ag-0.1Al solder propagated within the solder, but it was passed through the solder / Cu substrate interface for the module with a Sn-3Ag-0.5Cu. Micro-structuring process of the solder with Al addition could be discussed.
Description: Proceedings of "Electronics Goes Green 2004+ : Driving Forces for Future Electronics"
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Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 田中 順一

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