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Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability
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| Title: | Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability |
| Authors: | Tanaka, Junichi1 Browse this author | | Takashima, Toshiyuki Browse this author | | Yoshimi, Kenji Browse this author | | Serizawa, Koji Browse this author | | Narita, Toshio Browse this author |
| Authors(alt): | 田中, 順一1 |
| Keywords: | Pb-free | | Sn-Ag-Al solder |
| Issue Date: | Sep-2004 |
| Publisher: | Electronics Goes Green |
| Journal Title: | Electronics Goes Green 2004+ (EGG 2004) September 6-8, 2004, Berlin, Germany. |
| Abstract: | Addition of small amount of Al suppressed super cooling of Sn-Ag solders completely under normal cooling rates and the Sn-2Ag-0.1Al solder has a fine structure with an average grain sizes less than 10 micron-meter. Stress-strain measurements showed that the Sn-2Ag-0.1Al solder have fracture strain and toughness superior than the conventional Sn-Ag solders and wetting of the Sn-2Ag-0.1Al solder was moderate. Thermal cycling test was carried for the Cu / ceramic module with a 200 micro meter Sn-2Ag-0.1Al solder sheet between 233 and 398K. Dor comparison purpose conventional solders as Sn-3Ag-0.5Cu were also tested under the same thermal cycling condition. It was found that the Sn-2Ag-0.1Al solder was still sound after the 300 T.C. in contrast to results for Sn-3Ag-0.5Cu failed completely after the 150 T.C.. The crack formed in the module with a Sn-2Ag-0.1Al solder propagated within the solder, but it was passed through the solder / Cu substrate interface for the module with a Sn-3Ag-0.5Cu. Micro-structuring process of the solder with Al addition could be discussed. |
| Description: | Proceedings of "Electronics Goes Green 2004+ : Driving Forces for Future Electronics" |
| Description URI: | http://egg2004.izm.fraunhofer.de/ |
| Rights: | http://creativecommons.org/licenses/by-nc-sa/2.1/jp/ |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/447 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 田中 順一
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