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In situ transmission electron microscopy analysis of conductive filament during solid electrolyte resistance switching

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Title: In situ transmission electron microscopy analysis of conductive filament during solid electrolyte resistance switching
Authors: Fujii, Takashi Browse this author
Arita, Masashi Browse this author →KAKEN DB
Takahashi, Yasuo Browse this author
Fujiwara, Ichiro Browse this author
Keywords: copper
electrical conductivity transitions
electrical resistivity
electron diffraction
germanium compounds
metal-insulator boundaries
nanofabrication
nanostructured materials
solid electrolytes
thin films
transmission electron microscopy
X-ray chemical analysis
Issue Date: 23-May-2011
Publisher: American Institute of Physics
Journal Title: Applied Physics Letters
Volume: 98
Issue: 21
Start Page: 212104
Publisher DOI: 10.1063/1.3593494
Abstract: An in situ transmission electron microscopy (TEM) analysis of a solid electrolyte, Cu-GeS, during resistance switching is reported. Real-time observations of the filament formation and disappearance process were performed in the TEM instrument and the conductive-filament-formation model was confirmed experimentally. Narrow conductive filaments were formed corresponding to resistance switching from high- to low-resistance states. When the resistance changed to high- resistance state, the filament disappeared. It was also confirmed by use of selected area diffractometry and energy-dispersive x-ray spectroscopy that the conductive filament was made of nanocrystals composed mainly of Cu.
Rights: Copyright 2011 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Appl. Phys. Lett. 98, 212104 (2011) and may be found at https://dx.doi.org/10.1063/1.3593494
Type: article
URI: http://hdl.handle.net/2115/45755
Appears in Collections:情報科学院・情報科学研究院 (Graduate School of Information Science and Technology / Faculty of Information Science and Technology) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 有田 正志

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