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Effect of Copper Pretreatment on the Zincate Process and Subsequent Copper Electrodeposition of AZ31 Magnesium Alloy

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Title: Effect of Copper Pretreatment on the Zincate Process and Subsequent Copper Electrodeposition of AZ31 Magnesium Alloy
Authors: Tang, Jinwei Browse this author
Azumi, Kazuhisa Browse this author
Keywords: adhesion
aluminium alloys
magnesium alloys
manganese alloys
scanning electron microscopy
X-ray chemical analysis
Issue Date: 29-Jun-2011
Publisher: The Electrochemical Society
Journal Title: Journal of the Electrochemical Society
Volume: 158
Issue: 9
Start Page: D535
End Page: D540
Publisher DOI: 10.1149/1.3607426
Abstract: A small amount of Cu^[2+] ions was added to the activation bath used for pretreatment of the plating process of an AZ31 Mg alloy. In the activation process, a small amount of Cu was deposited at high density on the substrate surface accompanying Mg dissolution (Cu pretreatment). These Cu deposits acted as nucleation seeds for Zn deposition in the following zincate process and provided a uniform and dense Zn layer almost completely covering the substrate. The Cu layer electroplated on this zincated substrate showed considerable improvement in density and uniformity compared with those of the sample without Cu pretreatment. Cross-sectional SEM observation revealed that a less-defective interface between the Cu layer and substrate was obtained for the Cu-prepared sample. This structure also contributed to the improvement of adhesion strength. The mechanism of this improvement was investigated using electrochemical measurement and scanning electron microscopy observation with energy dispersive X-ray spectroscopy analysis.
Rights: © The Electrochemical Society, Inc. 2011. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in J. Electrochem. Soc., 158(9), pp. D535-D540 (2011)
Type: article
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 安住 和久

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