Surface flatness of polycrystalline copper after argon ion etching followed by annealing


Hokkaido University \| Library \| HUSCAP	Advanced Search		言語

	Home
	About HUSCAP
	Open Access Policy

	Browse by Author

Browse
	Communities & Collections

	Scholarly Journals
	Theses
	Doctoral Dissertations Listed by Graduate Schools
	Conference Procs.
	Events

	HUSCAP Senior (in Japanese)

	Societies

	Downloads (country)

For university staff
	How to post your papers to HUSCAP
	Publication of theses
	Helpline about theses publication

Open Archives Compliant

You can search our collection also at:
	Google
	Google Scholar
	CiNii
	IRDB
	OAIster
	NDLTD

Files in This Item:

JVSTB22-6.pdf

149.89 kB

PDF

Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/5710

Title:	Surface flatness of polycrystalline copper after argon ion etching followed by annealing
Authors:	Hino, T.¹ Browse this author →KAKEN DB
	Taguchi, T. Browse this author
	Yamauchi, Y. Browse this author
	Hirohata, Y. Browse this author
	Nishikawa, M. Browse this author
Authors(alt):	日野, 友明¹
Issue Date:	4-Nov-2004
Publisher:	AVS Science & Technology of Materials Interfaces, and Processing
Journal Title:	Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Volume:	22
Issue:	6
Start Page:	2632
End Page:	2634
Publisher DOI:	10.1116/1.1814110
Abstract:	Oblique injection of argon ions with energy of 1 keV was conducted for etching of polycrystalline copper. The surface became rough owing to the formation of blisters. The average diameter and height of blisters was approximately 150 and 20–30 nm, respectively. The polycrystalline copper irradiated by argon ions was annealed to rupture the blisters. The retained argon desorbed in the temperature range from 500 to 800 K. The height of blisters significantly reduced to 10–15 nm although the diameter and surface density of blisters roughly remained the same.
Type:	article (author version)
URI:	http://hdl.handle.net/2115/5710
Appears in Collections:	工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 日野友明

OAI-PMH ( junii2 , jpcoar_1.0 )

- Hokkaido University