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Interface bond between FRP sheets and concrete substrates: properties, numerical modeling and roles in member behaviour

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Title: Interface bond between FRP sheets and concrete substrates: properties, numerical modeling and roles in member behaviour
Authors: Ueda, Tamon1 Browse this author →KAKEN DB
Dai, Jianguo Browse this author
Authors(alt): 上田, 多門1
Keywords: fiber reinforced polymer (FRP)
sheet bonding
interface bond
bond models
anchorage design
optimized interface properties
Issue Date: Jan-2005
Publisher: John Wiley & Sons, Ltd.
Journal Title: Progress in Structural Engineering and Materials
Volume: 7
Issue: 1
Start Page: 27
End Page: 43
Publisher DOI: 10.1002/pse.187
Abstract: The success of most of strengthening or retrofitting technologies for concrete structures by using external bonded FRP sheets depends highly on the interface bond between the FRP sheets and concrete substrates. This paper reviews current studies on evaluating the bond properties of FRP sheet-concrete interfaces and, in particular, focuses on several newly developed bond models for describing the bond characteristics of FRP sheet-concrete interfaces under various loading conditions. This paper also gives several examples that apply these interfacial bond models to the design of different retrofitting cases. Analytical solutions are discussed that consider the local interfacial delamination and slip behaviour, which can improve the prediction of strength and deformation performances, as well as clarify the failure mechanisms of concrete members upgraded with FRP composites. Moreover, the improvement in structural performance of retrofitted concrete members is discussed by relating them to the optimum microscopic properties of the interface bond and the properties of retrofitting materials.
Rights: Copyright © 2005 John Wiley & Sons, Inc., PROGRESS IN STRUCTURAL ENGINEERING AND MATERIALS, Vol.7-1, p. 27-43
Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 上田 多門

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