Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers


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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/59816

Title:	Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers
Authors:	Yonezawa, Tetsu Browse this author →KAKEN DB
	Tsukamoto, Hiroki Browse this author
	Matsubara, Masaki Browse this author
Issue Date:	2015
Publisher:	Royal Society of Chemistry
Journal Title:	RSC advances
Volume:	5
Issue:	75
Start Page:	61290
End Page:	61297
Publisher DOI:	10.1039/c5ra06599b
Abstract:	A conductive paste was prepared with submicrometer-sized copper fine particles that were coated by a gelatin nanoskin. The average particle size was ca. 130 nm. After drying, an oxidation-reduction two-step sintering process was proposed for these submicrometer-sized copper fine particles to obtain low-resistivity layers at a very low temperature. The optimized conditions gave a low resistivity of 8.2 x 10(-6) Omega cm, even when the particles were covered by a common polymer. Our results suggest that the formation of the small copper oxide prominences on the surface of the copper fine particles could be reduced at low temperatures, forming connected submicrometer-sized metallic copper particles.
Rights:	http://creativecommons.org/licenses/by/3.0/
Type:	article
URI:	http://hdl.handle.net/2115/59816
Appears in Collections:	工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 米澤徹

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