Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation


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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/60845

Title:	Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation
Authors:	Yonezawa, Tetsu Browse this author →KAKEN DB
	Tsukamoto, Hiroki Browse this author
	Yong, Yingqiong Browse this author
	Mai Thanh Nguyen Browse this author
	Matsubara, Masaki Browse this author
Issue Date:	29-Jan-2016
Publisher:	Royal Society of Chemistry
Journal Title:	RSC advances
Volume:	6
Issue:	15
Start Page:	12048
End Page:	12052
Publisher DOI:	10.1039/c5ra25058g
Abstract:	A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degrees C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 x 10(-6) Omega m). This novel process may open a new strategy in the field of printed electronics.
Rights:	http://creativecommons.org/licenses/by/3.0/
Type:	article
URI:	http://hdl.handle.net/2115/60845
Appears in Collections:	工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 米澤徹

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