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Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

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Title: Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation
Authors: Yonezawa, Tetsu Browse this author →KAKEN DB
Tsukamoto, Hiroki Browse this author
Yong, Yingqiong Browse this author
Mai Thanh Nguyen Browse this author
Matsubara, Masaki Browse this author
Issue Date: 29-Jan-2016
Publisher: Royal Society of Chemistry
Journal Title: RSC advances
Volume: 6
Issue: 15
Start Page: 12048
End Page: 12052
Publisher DOI: 10.1039/c5ra25058g
Abstract: A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degrees C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 x 10(-6) Omega m). This novel process may open a new strategy in the field of printed electronics.
Rights: http://creativecommons.org/licenses/by/3.0/
Type: article
URI: http://hdl.handle.net/2115/60845
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 米澤 徹

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