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A new approach for additive-free room temperature sintering of conductive patterns using polymer-stabilized Sn nanoparticles

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Title: A new approach for additive-free room temperature sintering of conductive patterns using polymer-stabilized Sn nanoparticles
Authors: Shirai, Hiroaki Browse this author
Mai Thanh Nguyen Browse this author
Ishida, Yohei Browse this author
Yonezawa, Tetsu Browse this author →KAKEN DB
Keywords: Copper Fine Particles
Silver Nanoparticles
Alloy Nanoparticles
Melting-point
Ink
Films
Nanocrystals
Layer
Ag
Mechanism
Issue Date: 23-Feb-2016
Publisher: Royal Society of Chemistry
Journal Title: Journal of materials chemistry C
Volume: 4
Issue: 11
Start Page: 2228
End Page: 2234
Publisher DOI: 10.1039/c6tc00161k
Abstract: Tin nanoparticles (Sn NPs) are of considerable interest for conductive printing because of their low melting temperature and low cost. In the present study, polyvinylpyrrolidone (PVP) stabilized metallic Sn NPs were synthesized by a polyol process and the size of Sn NPs was controlled from 15 to 89 nm by adjusting the amount of PVP. For the first time, we demonstrated that conductive patterns fabricated from the inks of metallic Sn NPs were achieved readily at room temperature under N-2 without reducing gases or additives. The lowest obtained resistivity was 1.1 x 10 (3) Omega cm, which was 100 times higher than that of bulk Sn. The size of Sn NPs, the amount of the stabilizing agent, and the low melting temperature of Sn NPs were found to be the main factors controlling the conductivity of the obtained Sn pattern in room temperature sintering. This study offers a new approach for the room temperature fabrication of conductive electronics using the printing technique.
Rights: http://creativecommons.org/licenses/by/3.0/
Type: article
URI: http://hdl.handle.net/2115/61389
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 米澤 徹

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