HUSCAP logo Hokkaido Univ. logo

Hokkaido University Collection of Scholarly and Academic Papers >
Graduate School of Information Science and Technology / Faculty of Information Science and Technology >
Peer-reviewed Journal Articles, etc >

Investigation of Current Flow Between Turns of NI REBCO Pancake Coil by 2-D Finite-Element Method

Files in This Item:
EUCAS_fullpaper_after_minor_revision.pdf501.29 kBPDFView/Open
Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/62181

Title: Investigation of Current Flow Between Turns of NI REBCO Pancake Coil by 2-D Finite-Element Method
Authors: Noguchi, So Browse this author →KAKEN DB
Monma, Katsutoshi Browse this author
Igarashi, Hajime Browse this author →KAKEN DB
Ishiyama, Atsushi Browse this author
Keywords: Electromagnetic simulation
NI REBCO pancake coil
no-insulation winding technique
turn-to-turn contact surface resistivity
Issue Date: Apr-2016
Publisher: IEEE (Institute of Electrical and Electronics Engineers)
Journal Title: IEEE Transactions on Applied Superconductivity
Volume: 26
Issue: 3
Start Page: 4901205
Publisher DOI: 10.1109/TASC.2016.2536945
Abstract: The no-insulation (NI) winding technique for an NI ReBCO pancake coil is expected to improve dynamic and thermal stability and enhance current density. The investigations on electromagnetic and thermal behaviors are important for the development of NI ReBCO coils. Many stability investigations of the NI ReBCO coil itself have been carried out by experiments and simulations. However, the detailed behavior of the bypass current between turns has not been shown. Although contact resistivity was obtained through prior experiment, it included the resistivity of not only contact surface but also the components, i.e., the copper stabilizer and the Hastelloy substrate, of a ReBCO tape. To investigate the detailed bypass current behavior in this paper, the true contact surface resistivity is taken into account in the simulation. The bypass current on the cross section of the NI ReBCO tape is simulated using the two-dimensional finite-element method. From the simulation results, the influence of the coil-radial resistivity between turns on the turn-to-turn contact surface resistivity is clarified. In addition, the heat loss is also reported, and a simple equivalent circuit of the turn-to-turn contact is proposed.
Rights: © 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Type: article (author version)
URI: http://hdl.handle.net/2115/62181
Appears in Collections:情報科学院・情報科学研究院 (Graduate School of Information Science and Technology / Faculty of Information Science and Technology) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 野口 聡

Export metadata:

OAI-PMH ( junii2 , jpcoar )

MathJax is now OFF:


 

 - Hokkaido University