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Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
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| Title: | Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature |
| Authors: | Yong, Yingqiong Browse this author | | Mai Thanh Nguyen Browse this author | | Yonezawa, Tetsu Browse this author →KAKEN DB | | Asano, Takashi Browse this author | | Matsubara, Masaki Browse this author | | Tsukamoto, Hiroki Browse this author | | Liao, Ying-Chih Browse this author | | Zhang, Tengfei Browse this author | | Isobe, Shigehito Browse this author →KAKEN DB | | Nakagawa, Yuki Browse this author |
| Issue Date: | 2017 |
| Publisher: | Royal Society of Chemistry |
| Journal Title: | Journal of materials chemistry C |
| Volume: | 5 |
| Issue: | 5 |
| Start Page: | 1033 |
| End Page: | 1041 |
| Publisher DOI: | 10.1039/c6tc04360g |
| Abstract: | A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2- propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 degrees C. Following sintering at a temperature of 100 degrees C, the lowest reported resistivity (8.8 x 10(-7) Omega m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex. |
| Rights: | https://creativecommons.org/licenses/by/3.0/ |
| Type: | article |
| URI: | http://hdl.handle.net/2115/65126 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 米澤 徹
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