HUSCAP logo Hokkaido Univ. logo

Hokkaido University Collection of Scholarly and Academic Papers >
Graduate School of Engineering / Faculty of Engineering >
Peer-reviewed Journal Articles, etc >

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

This item is licensed under: Creative Commons Attribution 3.0 Unported

Files in This Item:
Supplementary information.pdf707.78 kBPDFView/Open
c6tc04360g.pdf4.42 MBPDFView/Open
Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/65126

Title: Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
Authors: Yong, Yingqiong Browse this author
Mai Thanh Nguyen Browse this author
Yonezawa, Tetsu Browse this author →KAKEN DB
Asano, Takashi Browse this author
Matsubara, Masaki Browse this author
Tsukamoto, Hiroki Browse this author
Liao, Ying-Chih Browse this author
Zhang, Tengfei Browse this author
Isobe, Shigehito Browse this author →KAKEN DB
Nakagawa, Yuki Browse this author
Issue Date: 2017
Publisher: Royal Society of Chemistry
Journal Title: Journal of materials chemistry C
Volume: 5
Issue: 5
Start Page: 1033
End Page: 1041
Publisher DOI: 10.1039/c6tc04360g
Abstract: A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2- propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 degrees C. Following sintering at a temperature of 100 degrees C, the lowest reported resistivity (8.8 x 10(-7) Omega m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex.
Rights: https://creativecommons.org/licenses/by/3.0/
Type: article
URI: http://hdl.handle.net/2115/65126
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 米澤 徹

Export metadata:

OAI-PMH ( junii2 , jpcoar )

MathJax is now OFF:


 

 - Hokkaido University