Temperature Dependence of Behavior of Interface Between Molten Sn and LiCl-KCl Eutectic Melt Due to Rising Gas Bubble

Natsui, Shungo; Nashimoto, Ryota; Takai, Hifumi; Kumagai, Takehiko; Kikuchi, Tatsuya; Suzuki, Ryosuke O.

doi:10.1007/s11663-016-0618-9


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Temperature Dependence of Behavior of Interface Between Molten Sn and LiCl-KCl Eutectic Melt Due to Rising Gas Bubble

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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/65864

Title:	Temperature Dependence of Behavior of Interface Between Molten Sn and LiCl-KCl Eutectic Melt Due to Rising Gas Bubble
Authors:	Natsui, Shungo Browse this author →KAKEN DB
	Nashimoto, Ryota Browse this author
	Takai, Hifumi Browse this author
	Kumagai, Takehiko Browse this author
	Kikuchi, Tatsuya Browse this author →KAKEN DB
	Suzuki, Ryosuke O. Browse this author →KAKEN DB
Keywords:	LIQUID LIQUID INTERFACES
	SYSTEMS
	SLAG
	ENTRAINMENT
	ENTRAPMENT
	MECHANISMS
	SEPARATION
	PRESSURE
	MODEL
Issue Date:	Jun-2016
Publisher:	Springer
Journal Title:	Metallurgical and materials transactions B-process metallurgy and materials processing science
Volume:	47
Issue:	3
Start Page:	1532
End Page:	1537
Publisher DOI:	10.1007/s11663-016-0618-9
Abstract:	The behavior of the interface between molten Sn and the LiCl-KCl eutectic melt system was observed directly. We found that the transient behavior of the interface exhibits considerable temperature dependence through a change in its physical properties. The "metal film" generated in the upper molten salt phase significantly influences the shape of the interface. Although the lifetime of the metal film depends on the gas flow rate, it is not affected by the buoyancy if the interfacial tension is dominant. (C) The Minerals, Metals & Materials Society and ASM International 2016
Rights:	The final publication is available at Springer via http://dx.doi.org/10.1007/s11663-016-0618-9.
Type:	article (author version)
URI:	http://hdl.handle.net/2115/65864
Appears in Collections:	工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 夏井俊悟

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