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Formation of layered structure porous-type anodic alumina films locally with a solution flow-type micro-droplet cell
| Title: | Formation of layered structure porous-type anodic alumina films locally with a solution flow-type micro-droplet cell |
| Authors: | Sakairi, Masatoshi Browse this author →KAKEN DB | | Nishino, Fumika Browse this author | | Itzinger, Regina Browse this author |
| Keywords: | solution flow-type micro-droplet cell | | porous-type alumina | | anodizing | | layered structure | | pore widening |
| Issue Date: | Aug-2016 |
| Publisher: | Wiley-Blackwell |
| Journal Title: | Surface and interface analysis |
| Volume: | 48 |
| Issue: | 8 |
| Start Page: | 921 |
| End Page: | 925 |
| Publisher DOI: | 10.1002/sia.5893 |
| Abstract: | A solution flow-type micro-droplet cellwith co-axial dual capillary tubes (Sf-MDC) was applied to formporous-type anodic alumina film with layered structure at selected areas on aluminum. The anodizing process with different repetition numbers, yielding different oxide layer numbers, was performed with the Sf-MDC. The investigation of cross sections of the formed oxide showed that the pore diameter widened at the boundary between layers. From a simulated anodizing process with the Sf-MDC, the reason for this modification of the pores was suggested to be intermittent anodizing with processes of drying up of the solution of the pores and widening at the bottom of the pores. Copyright (C) 2015 John Wiley & Sons, Ltd. |
| Rights: | This is the peer reviewed version of the following article: Surface and interface analysis, 48(8), August 2016, pp.921-925, which has been published in final form at http://onlinelibrary.wiley.com/doi/10.1002/sia.5893/abstract. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving. |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/66899 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 坂入 正敏
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