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Electromagnetic, Thermal, and Mechanical Quench Simulation of NI REBCO Pancake Coils for High Magnetic Field Generation

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Title: Electromagnetic, Thermal, and Mechanical Quench Simulation of NI REBCO Pancake Coils for High Magnetic Field Generation
Authors: Noguchi, So Browse this author →KAKEN DB
Keywords: Equivalent electric circuit model
REBCO magnet
screening current
simulation
Issue Date: Aug-2019
Publisher: IEEE (Institute of Electrical and Electronics Engineers)
Journal Title: IEEE transactions on applied superconductivity
Volume: 29
Issue: 5
Start Page: 4602607
Publisher DOI: 10.1109/TASC.2019.2904317
Abstract: The no-insulation (NI) winding technique drastically enhances the thermal stability of REBa2Cu3Oy (REBCO) coils. Even if a larger current than a critical current is carried in NI REBCO pancake coils, the coils would not burn out. So far, many NI REBCO pancake coils showed a "self-protecting" characteristic in experiments. However, most of these experiments have been done under a low magnetic field or cooled by liquid nitrogen. Under these conditions, a huge electromagnetic force does not occur after an NI REBCO pancake coil transitions into a normal state. Recently, the NI winding technique has been applied to high-field magnets, such as NMR and accelerators. Under a high magnetic field (> 20 T), a huge hoop stress is generated after one NI REBCO pancake coil constituting a high-field magnet by stacking reaches to quench. The huge hoop stress causes the delamination of REBCO-coated conductors. That is, the quench protection condition of high-field NI REBCO magnets is decided according to the mechanical condition, even though the magnets show a high thermal stability. In this paper, three simulation models for NI REBCO pancake coils are compared, and then the mechanical condition is discussed for a quench protection through an electromagnetic, thermal, and mechanical simulation of multistacked NI REBCO pancake coils for high field generation.
Rights: © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Type: article (author version)
URI: http://hdl.handle.net/2115/74530
Appears in Collections:情報科学院・情報科学研究院 (Graduate School of Information Science and Technology / Faculty of Information Science and Technology) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 野口 聡

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