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Structure Control of Cu-Zn Microchannel Lining Layers with Electrochemical Dissolution

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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/74633

Title: Structure Control of Cu-Zn Microchannel Lining Layers with Electrochemical Dissolution
Authors: Kobayashi, Kazuki Browse this author
Ohmi, Tatsuya Browse this author →KAKEN DB
Kumagai, Takehiko Browse this author →KAKEN DB
Sakairi, Masatoshi Browse this author →KAKEN DB
Iguchi, Manabu Browse this author
Keywords: Powder Metallurgy
Potentiostatic Dissolution
Copper-Zinc Alloy
Catalyst
Microreactor
Microchannel
Issue Date: 1-Jul-2012
Publisher: 日本実験力学会
Journal Title: 実験力学
Journal Title(alt): Journal of JSEM
Volume: 12
Issue: Special Issue
Start Page: s213
End Page: s216
Publisher DOI: 10.11395/jjsem.12.s213
Abstract: The effect of potentiostatic dissolution on the structure of a Cu-Zn alloy microchannel lining layer was investigated. The microchannel lining layer was fabricated by a powder-metallurgical process using copper powder and zinc wire. The lining layer became more porous after potentiostatic dissolution at a constant potential of −0.5 V vs. Ag/AgCl. The lining layer was remarkably dezinced and it contained many open pores under the dissolution condition at +0.5 V. These results indicate the possibility of precise structure control of the microchannel lining layer.
Rights: 著作権は日本実験力学会にある。利用は著作権の範囲内に限られる。
Type: article
URI: http://hdl.handle.net/2115/74633
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 大参 達也

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