HUSCAP logo Hokkaido Univ. logo

Hokkaido University Collection of Scholarly and Academic Papers >
Graduate School of Engineering / Faculty of Engineering >
Peer-reviewed Journal Articles, etc >

高温用金属系マイクロチャンネルデバイスの創製法

Files in This Item:
J.JSEM 5. 234.pdf1.23 MBPDFView/Open
Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/74655

Title: 高温用金属系マイクロチャンネルデバイスの創製法
Other Titles: Fabrication Process for Metallic Microchannel Devices for High-Temperature Use
Authors: 大参, 達也1 Browse this author →KAKEN DB
高遠, 将史2 Browse this author
井口, 学3 Browse this author
松浦, 清隆4 Browse this author →KAKEN DB
工藤, 昌行5 Browse this author
Authors(alt): Ohmi, Tatsuya1
Takatoo, Masashi2
Iguchi, Manabu3
Matsuura, Kiyotaka4
Kudoh, Masayuki5
Keywords: microchannel
microreactor
powder metallurgy
infiltration
intermetallic compound
Issue Date: 2005
Publisher: 日本実験力学会
Journal Title: 実験力学
Journal Title(alt): Journal of JSEM
Volume: 5
Issue: 3
Start Page: 234
End Page: 238
Publisher DOI: 10.11395/jjsem.5.234
Abstract: A simple and economical fabricating process for free-form microchannels in metal bodies has been proposed. The concept for our process is based on a microscopic infiltration phenomenon that often occurs during liquid phase sintering of a mixture of different metals powder, e.g., a mixture of titanium and aluminum. In our microchanneling process, a shaped compound of aluminum powder and an organic binder is used as a sacrificial core. The powder-binder compound is formed into the same shape as the intended microchannel-network by a micro-injection process. A titanium powder compact containing the sacrificial core is sintered at a temperature above the melting point of aluminum. During sintering of the powder compact, the organic binder is removed and liquid aluminum originating from the aluminum powder flows into narrow capillaries between the titanium powder particles and reacts with the titanium particles to produce Ti-Al alloy layers lining the cavity formed at the sites initially occupied by the powder-binder compound. The composition, phase and structure of the lining layers can be changed by the addition of a third element into the powder-binder compound.
Rights: 著作権は日本実験力学会にある。利用は著作権の範囲内に限られる。
Type: article
URI: http://hdl.handle.net/2115/74655
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 大参 達也

Export metadata:

OAI-PMH ( junii2 , jpcoar )

MathJax is now OFF:


 

 - Hokkaido University