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Powder-Metallurgical Process for Producing Metallic Microchannel Devices

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Title: Powder-Metallurgical Process for Producing Metallic Microchannel Devices
Authors: Ohmi, Tatsuya Browse this author →KAKEN DB
Takatoo, Masashi Browse this author
Iguchi, Manabu Browse this author
Matsuura, Kiyotaka Browse this author →KAKEN DB
Kudoh, Masayuki Browse this author
Keywords: microchannel
powder metallurgy
intermetallic compound
functional-material lining
Issue Date: Sep-2006
Publisher: The Japan Institute of Metals
Volume: 47
Issue: 9
Start Page: 2137
End Page: 2142
Publisher DOI: 10.2320/matertrans.47.2137
Abstract: We investigated a simple and economical method for producing free-form microchannels in metal bodies. The concept for our process is based on a microscopic infiltration phenomenon that often occurs during liquid phase sintering of a mixture of metal powders with different melting points. A shaped compound of the metal powder with lower melting point and an organic binder are used as the sacrificial core that gives the shape of the microchannel. A body-metal powder compact that includes the sacrificial core is sintered at a temperature between the melting points of the sacrificial-core metal and body metal. The organic binder is removed during heating of the powder compact, and infiltration of molten sacrificial-core metal into the body-metal powder produces a microchannel and a lining layer. We examined following combinations of metal powders: titanium-aluminum, nickel-aluminum, copper-tin, and iron-copper. Metallographic observations confirmed that microchannels were produced in the metallic bodies in all these systems. Furthermore, in the case of the titanium body metal with an Al-Cu alloy sacrificial-core metal, the inner wall of the microchannel was smoother than the case of titanium with aluminum. The copper content of the sacrificial-core metal influenced the composition and structure of the microchannel lining.
Type: article
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 大参 達也

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