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Highly increased breakdown potential of anodic films on aluminum using a sealed porous layer

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Title: Highly increased breakdown potential of anodic films on aluminum using a sealed porous layer
Authors: Cao, Jin-Hui Browse this author
Sato, Yuki Browse this author →KAKEN DB
Kowalski, Damian Browse this author
Zhu, Chunyu Browse this author →KAKEN DB
Aoki, Yoshitaka Browse this author →KAKEN DB
Cheng, Yingliang Browse this author
Habazaki, Hiroki Browse this author →KAKEN DB
Keywords: Anodizing
Anodic film
Pore sealing
Electric breakdown
Issue Date: Jul-2018
Publisher: Springer
Journal Title: Journal of Solid State Electrochemistry
Volume: 22
Issue: 7
Start Page: 2073
End Page: 2081
Publisher DOI: 10.1007/s10008-018-3913-3
Abstract: The growth of a uniform barrier-type anodic film on aluminum is usually terminated by electric breakdown, which is controlled by the resistance of electrolyte or anion concentration. In this study, highly resistive porous layers have been introduced by anodizing aluminum in sulfuric acid electrolyte followed by boiling water treatment to examine their influence on the electric breakdown potential. The pores of the porous alumina film are sealed by forming hydrated alumina (pseudo-boehmite) after the boiling water treatment. The breakdown potential increases to over 1500 V for the pore-sealed aluminum specimens on anodizing in sodium tungstate electrolyte. The electrochemical impedance spectroscopy measurements revealed an increased resistance of the porous layer after the pore-sealing treatment. GDOES depth profile analysis disclosed that the sealed porous layer impedes the incorporation of tungsten species into the barrier layer. The introduction of a highly resistive layer that also suppresses the anion incorporation on aluminum is effective in increasing the breakdown potential of anodic films.
Rights: The final publication is available at
Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 幅崎 浩樹

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