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Low-Temperature Creep at Ultra-Low Strain Rates in Pure Aluminum Studied by a Helicoid Spring Specimen Technique

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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/75556

Title: Low-Temperature Creep at Ultra-Low Strain Rates in Pure Aluminum Studied by a Helicoid Spring Specimen Technique
Authors: Shen, Junjie Browse this author
Yamasaki, Shigeto Browse this author
Ikeda, Ken-ichi Browse this author →KAKEN DB
Hata, Satoshi Browse this author
Nakashima, Hideharu Browse this author
Keywords: pure aluminum
dislocation
ultra-low strain rate
helicoid spring creep test
grain boundary
stress exponent
Issue Date: 1-Jul-2011
Publisher: The Japan Institute of Metals
Journal Title: MATERIALS TRANSACTIONS
Volume: 52
Issue: 7
Start Page: 1381
End Page: 1387
Publisher DOI: 10.2320/matertrans.M2010405
Abstract: The creep behavior in pure aluminum has been investigated by helicoid spring creep tests at strain rates, \\dotε, lower than 10−10 s−1 and low temperature ranging from 0.32Tm to 0.43Tm. It was found that the creep behavior in this region depends strongly on grain sizes and impurity concentrations. For high-purity aluminum (5 N Al) with an average grain size, dg>1600 μm, nearly the wire diameter of the spring sample, where the role of grain boundary during creep deformation can be negligible, the stress exponent was n∼5 and the activation energy was Qc=32 kJ/mol. Microstructural observation showed the formation of large dislocation cells (∼10 μm) and tangled dislocations at the cell walls. For high-purity aluminum (5 N Al) with dg=24 μm, the stress exponent was n∼1 and the activation energy was Qc=15 kJ/mol. On the other hand, for commercial low-purity aluminum (2 N Al) with dg=25 μm, the stress exponent was n=2 and the activation energy was Qc=25 kJ/mol. Microstructural observations revealed dislocations emitted from grain boundaries, those dislocations interacting with intragranular dislocations and the formation of dislocation cells in the grains. Based on those experimental results, the low-temperature creep mechanisms in pure aluminum at \\dotε<10−10 s−1 have been discussed.
Type: article
URI: http://hdl.handle.net/2115/75556
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 池田 賢一

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