Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

Takata, Naoki; Yamada, Kousuke; Ikeda, Ken-ichi; Yoshida, Fuyuki; Nakashima, Hideharu; Tsuji, Nobuhiro

doi:10.2320/matertrans.MA200701


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Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

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Title:	Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding
Authors:	Takata, Naoki Browse this author
	Yamada, Kousuke Browse this author
	Ikeda, Ken-ichi Browse this author →KAKEN DB
	Yoshida, Fuyuki Browse this author
	Nakashima, Hideharu Browse this author
	Tsuji, Nobuhiro Browse this author
Keywords:	severe plastic deformation
	ultra-fine grains
	recrystallization
	stored energy
	cube texture
Issue Date:	1-Aug-2007
Publisher:	The Japan Institute of Metals
Journal Title:	MATERIALS TRANSACTIONS
Volume:	48
Issue:	8
Start Page:	2043
End Page:	2048
Publisher DOI:	10.2320/matertrans.MA200701
Abstract:	Pure copper sheets were heavily deformed up to equivalent strain of 4.8 by the accumulative roll-bonding (ARB) processed and then annealed. The ARB processed copper showed the ultra-fine grained microstructure which consisted of relatively equiaxed grains having grain thickness of about 0.2 μm. The DSC measurement of the ARB processed specimens revealed that the recrystallization temperature significantly decreased with increasing the number of the ARB cycles. The stored energy did not increase so much at later stage of ARB, which corresponded with the change in microstructure. The recystallization behavior of the ARB processed copper was governed by discontinuous recrystallization characterized by nucleation and growth process. Remarkable development of cube texture ({100}⟨001⟩) was found in the specimen deformed to the equivalent strain of 3.2 or larger and then annealed. The concentration of the cube recrystallization texture depended on the number of ARB cycles.
Type:	article
URI:	http://hdl.handle.net/2115/75559
Appears in Collections:	工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 池田賢一

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