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高温融体界面と分散相挙動の数値解析 : Smoothed Particle Hydrodynamics 法の製錬プロセス解析への応用

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Title: 高温融体界面と分散相挙動の数値解析 : Smoothed Particle Hydrodynamics 法の製錬プロセス解析への応用
Other Titles: Numerical Analysis of Interfacial Morphology and Dispersion Behavior of High-Temperature Melts : Application of Smoothed Particle Hydrodynamics to Metallurgical Processing Analysis
Authors: 夏井, 俊悟1 Browse this author →KAKEN DB
梨元, 涼太2 Browse this author
問谷, 一偉3 Browse this author
澤田, 旺成4 Browse this author
菊地, 竜也5 Browse this author →KAKEN DB
鈴木, 亮輔6 Browse this author →KAKEN DB
Authors(alt): Natsui, Shungo1
Nashimoto, Ryota2
Tonya, Kazui3
Sawada, Akinori4
Kikuchi, Tatsuya5
Suzuki, Ryosuke O.6
Keywords: High-Temperature Melt
Dispersed Phase
Metalugical Process
SPH Method
Issue Date: 31-Aug-2019
Publisher: 資源・素材学会
Journal Title: Journal of MMIJ
Volume: 135
Issue: 8
Start Page: 71
End Page: 82
Publisher DOI: 10.2473/journalofmmij.135.71
Abstract: The transient behavior of the multi-interfacial flow can be modeled using recent Smoothed Particle Hydrodynamics (SPH) model. This developed numerical method is fully-Lagrangian particle-based approach, which can track the movement of many fluid phase directly. The advantage of this simulation model is a direct calculation in both of dispersed phase and continuous phase seamlessly. Thereby this model estimates transient behavior of interfacial behavior by predicting the changes of each interface shape. For example, numerical simulations have been performed for different conditions corresponding to different values of surface tension, viscosity and density, and the predicted topological changes as well as the theoretical interfacial shape of droplets can be validated. Based on this model, we carried out relatively large-scale interfacial flow simulations, investigated case studies of metallurgical processing, and evaluated the non-steady state flow of formed from various dispersed phase.
Type: article
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 夏井 俊悟

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