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Development of a Low Solution Resistance Type Solution Flow Droplet Cell and Investigation of Its Electrochemical Performance

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ISIJ Int. 50(10)_ 1466-1470 (2010).pdf1.38 MBPDFView/Open
Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/76148

Title: Development of a Low Solution Resistance Type Solution Flow Droplet Cell and Investigation of Its Electrochemical Performance
Authors: Sakairi, Masatoshi Browse this author →KAKEN DB
Murata, Takuya Browse this author
Kikuchi, Tatsuya Browse this author →KAKEN DB
Fushimi, Koji Browse this author →KAKEN DB
Keywords: solution flow type droplet cell
local electrochemistry
corrosion
Issue Date: 15-Oct-2010
Publisher: 日本鉄鋼協会
Journal Title: ISIJ International
Volume: 50
Issue: 10
Start Page: 1466
End Page: 1470
Publisher DOI: 10.2355/isijinternational.50.1466
Abstract: A solution resistance reduced solution flow type micro-droplet cell with co-axial dual capillary tubes was developed. A Pt counter electrode wire, 50 μm diameter, inserted in the inner capillary tube, successfully reduced solution resistance between the working and counter electrodes. The potentio-dynamic polarization measurements showed the electrochemical performance of developed droplet cell to be very similar to that of traditional macro sized electrochemical cells. The developed droplet cell was applied to obtain line profiles of a current at a constant potential across the surface of for cross-sections of model metal interfaces. The current changed at the model interface between deposited nickel and substrate, and the spatial resolution of the developed droplet cell was reduced with increasing scanning speed of the cell. The results reported in this paper suggest that this technique would be able to measure differences in corrosion resistance in welded metal components and base metals.
Rights: 著作権は日本鉄鋼協会にある
Type: article
URI: http://hdl.handle.net/2115/76148
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 坂入 正敏

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