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J. Jpn Inst. Met. Mater. 60(9) 884.pdf1.11 MBPDFView/Open
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Title: 窒化珪素セラミックス・金属接合体の熱サイクルに伴う疲労特性の変化
Other Titles: Change in Fatigue Properties of Silicon Nitride Ceramics and Metal Joints with Thermal Cycling
Authors: 成田, 敏夫1 Browse this author
林, 重成2 Browse this author →KAKEN DB
秦, 昌平3 Browse this author
Authors(alt): Narita, Toshio1
Hayashi, Shigenari2
Hata, Shohei3
Keywords: ceramic/metal joints
thermal cyclic behavior
silicon nitride ceramic
active alloy brazing filers
scanning acoustic microscopy
extrusion of metals
crack formation
degradation of the joints
fatigue property
Issue Date: Sep-1996
Publisher: 日本金属学会
Journal Title: 日本金属学会誌
Journal Title(alt): Journal of the Japan Institute of Metals
Volume: 60
Issue: 9
Start Page: 884
End Page: 889
Publisher DOI: 10.2320/jinstmet1952.60.9_884
Abstract: Metals of Ni or Cu joined to Si3N4 ceramics with Ag- or Ni-brazing filler (Ag-Cu-Ti and Ni-Cu-Ti) were thermally cycled in vacuum between room temperature and the temperatures of 573, 723 and 873 K, and then the surface distortion and fracture strength of the joints were measured using scanning acoustic microscopy and a four-point bending test. In the case of the RT-573 K cycling there was little change in the joints, whereas Ni and Cu metals swelled at both of the RT-723 K and RT-873 K cycles and Ni swelling was much larger than that of Cu due to Ni plate sliding at the Ag-rich layer formed within the brazing filler. The fracture strength decreased significantly after the thermal-cyclings, because of the crack formation near the ceramic/filler interface. In the case of the Si3N4/Ni joint the Ni metal shrank at the early stages of the thermal cycling and then it tended to swell with the crack formation near ceramic-filler interfaces. The integrity of ceramic/metal joints could be controlled by the mechanical properties of metal components at the elevated temperatures.
Type: article
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 林 重成

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