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Recrystallization of cold rolled oxide dispersion strengthened copper during room temperature annealing

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Title: Recrystallization of cold rolled oxide dispersion strengthened copper during room temperature annealing
Authors: Aghamiri, S. M. S. Browse this author
Ukai, S. Browse this author →KAKEN DB
Oono, N. Browse this author
Kasada, R. Browse this author
Noto, H. Browse this author
Hishinuma, Y. Browse this author
Muroga, T. Browse this author
Keywords: Static discontinuous recrystallization
Grain boundary
Texture
Mechanical strength
Misorientation angle distribution
Issue Date: 25-Aug-2019
Publisher: Elsevier
Journal Title: Journal of alloys and compounds
Volume: 798
Start Page: 187
End Page: 193
Publisher DOI: 10.1016/j.jallcom.2019.05.248
Abstract: Static discontinuous recrystallization was studied during room temperature annealing of a newly designed 80% room temperature rolled oxide dispersion strengthened copper. At early stages of annealing, fine new oriented nanosized/submicron grains were recrystallized in the unique matrix of single brass-oriented deformed grain. Upon longer annealing time up to 14 months, the size, area fraction and number density of the recrystallized grains increased significantly along with changing the crystallographic textures. The analysis of misorientation angle distribution of boundaries indicated transformation of low angle boundaries to high angle boundaries results in nucleation of recrystallized grains by significant contribution of static recovery. Furthermore, the constant level of mechanical hardness after recrystallization was interpreted by the balance between grain size hardening, oxide particle hardening and strain hardening. (C) 2019 Elsevier B.V. All rights reserved.
Rights: © 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
http://creativecommons.org/licenses/by-nc-nd/4.0/
Type: article (author version)
URI: http://hdl.handle.net/2115/82518
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: S. Mohammad S. Aghamiri

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