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Investigation on Mechanical Damage of No-Insulation REBCO Pancake Coil by Multi-Physics Quench Simulation
| Title: | Investigation on Mechanical Damage of No-Insulation REBCO Pancake Coil by Multi-Physics Quench Simulation |
| Authors: | Mori, Shumpei Browse this author | | Noguchi, So Browse this author →KAKEN DB |
| Keywords: | Elastic analysis | | mechanical damage | | multi-physics simulation | | no-insulation winding technique | | REBCO coil |
| Issue Date: | Aug-2021 |
| Publisher: | IEEE (Institute of Electrical and Electronics Engineers) |
| Journal Title: | IEEE transactions on applied superconductivity |
| Volume: | 31 |
| Issue: | 5 |
| Start Page: | 8400305 |
| Publisher DOI: | 10.1109/TASC.2021.3058538 |
| Abstract: | A no-insulation (NI) winding technique greatly improves the thermal stability of REBa2Cu3Ox (RE = Rare Earth; REBCO) pancake coils. Since it has recently been pointed out that strong electromagnetic forces due to induced currents cause mechanical damage to NI REBCO coils during quench propagation under high magnetic field. The mechanical stability must he investigated and discussed further. We have developed a multi-physics quench simulation for NI REBCO pancake coils by combining a 2D stress/strain finite element analysis (FEA) with an electromagnetic field analysis of partial element equivalent circuit (PEEC) method and a 2D thermal FEA. The simulation results showed the consistency with the experimental results. |
| Rights: | © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/82847 |
| Appears in Collections: | 情報科学院・情報科学研究院 (Graduate School of Information Science and Technology / Faculty of Information Science and Technology) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 野口 聡
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